GIGAfab – Plasma systems for single-wafer operation

Movie: Impression of the handling procedure inside a GIGAfab A300


This particular type of machine was initially designed for the treatment of 300mm wafers within the Frontend of semiconductor production. Following the trend of wafer level packaging, this plasma system was recently re-designed also for the utilization within the Backend area.

The video shows the procedure when the robot arm handles a 300mm wafer between Front Opening Unified Pod (FOUP) station, pre-aligner, plasma chamber, cooling station and finally back into the FOUP.

For further informations about Plasma Systems for the Semiconductor Industry please click here.


Immediate Contact

slideoutcontact
You will receive a copy of your request in your inbox.
Please complete all fields marked with *.
Please solve the following question:
captcha

PVA TePla AG
Im Westpark 10 - 12
D-35435 Wettenberg

Phone: +49 (0) 641/68690-0
Fax: +49 (0) 641/68690-800

Please rate our Service

Daten
Please rate our service operation / service technician according to the following criteria:
(1 star deficient, 5 stars very good)
Please solve the following question:
captcha

Please rate our training

Daten
Please rate our training according to the following criteria:
(0 points deficient, 5 points very good)
Please solve the following question:
captcha
L=