Our front end plasma systems remove organic layers or residual contamination quickly and effectively during any step of wafer processing, allowing the subsequent processes to run quickly and effectively. In addition, our plasma systems dedicated to back end applications clean and activate substrates and dies to guarantees our customers an optimum yield in production.
Our analysis systems use optical and chemical processes to highlight and prove defects and contamination. This enables our customers to instigate appropriate rectification measures, thus reducing the costs incurred by a product failure
