The plasma system GIGA 690 is the successor model to the PS400 and PS660 and has become well established on the market since its launch in 2008. As a low-pressure microwave plasma system, it is designed for the cleaning and activation of semiconductor components in chip packaging, including before die-attach, wire bonding, flip-chip underfilling, and encapsulation. To this end, microwaves of 2.45 GHz are introduced through a window into the vacuum chamber, where they generate a chemically reactive plasma. This process allows particularly fast and damage-free plasma treatment.
The system can be operated both in manual and automatic mode; its user-friendly software meets the SEMI standards.