Batch Wafer Systems

The plasma systems for the batch process of PVA Metrology & Plasma Solutions all follow the same principle of plasma generation: direct coupling of the highly-frequency stimulation of the atmospheric side in the vacuum chamber. The gas inlet is situated on one side of the chamber and the vacuum suction on the opposite side. This chamber geometry achieves a particularly consistent process outcome.

The modular control system uses a latest-generation processor, a Linux-based platform as the operating system, and a graphical user interface (GUI). Consequently, the processes can be controlled both manually and fully automatically, and the process gases are controlled via MFC. During the process, all parameters are written into a recipe and stored in the database. In parallel with this, the current values for pressure, gas flow, output, etc. are shown on a display that triggers a corresponding alarm in the event of deviations from the target value.

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Plasma-info@pvatepla.com

Our Batch Wafer Systems

  • Plasma System GIGAbatch 310M

    The plasma system GIGAbatch 310M is the entry-level model of the GIGAbatch product range. As the smallest system, it is the most cost-effective variant for use in laboratories and universities. However, even in the basic version, it can also be used to perform manual and automatic plasma processes with an MFC gas duct and the 600 W generator.

    • Table-top version of the basic model; provides space for a second gas duct
    • The chamber can hold up to 25 wafers with a diameter of 150 mm—either as a batch in a quartz boat or as a single substrate with special devices for loading
    • Wide range of accessories for individual configuration

    A configuration with special sealing material, a chamber with a cooling plate, and a recirculating chiller is available for removing SU-8 from a wafer.

  • Plasma System GIGAbatch 360/380M

    The plasma systems GIGAbatch 360M and 380M designed for the needs of small production runs with low requirements. The 360 version has a process chamber with a diameter of 245 mm and can hold up to 50 wafers with a diameter of 150 mm. In the 380 system, the chamber has an inner diameter of 300 mm and therefore provides space for 25 wafers with a diameter of 200 mm.

    The basic version is a floor-mounted device with painted paneling, adjustable feet, and casters. It has a generator with an output of 1000 W, two MFC gas ducts, temperature monitoring for the wafers, and an endpoint detection system. In addition, a device to hold the wafers and substrates is included. It is mounted inside on the chamber door and designed in line with the respective customer requirements.

    Also available on request:

    • An active control device for the process pressure (DSC)
    • A Faraday cage
    • Additional gas ducts
    • Loading devices for different-sized substrates or wafers
    • A ceramic process chamber
    • Special seals for operation with process gas containing fluorine
  • Plasma System GIGAbatch 360/380P

    The plasma systems GIGAbatch 360P and 380P are suitable for the most challenging requirements in the semiconductor industry and use the same chamber geometry. The 360P model, with a chamber diameter of 245 mm, can hold up to 50 wafers with a diameter of 150 mm. In the 380P system, the chamber has an inner diameter of 300 mm and therefore space for 25 wafers with a diameter of 200 mm. The difference from the systems in the M series is the compatibility of the P systems with the requirements of cleanrooms up to class 100.

    Special attention was paid to the requirements of production lines regarding particle avoidance and metal contamination.

    This basic version consists of:

    • A floor-mounted device with panelings made of stainless-steel, adjustable feet, and casters
    • It has a generator with an output of 1000 W, two gas ducts with bellows valves, and MFC
    • It has temperature monitoring for the wafers and an endpoint detection system

    The process chamber door has a motor drive and can be equipped with devices to hold quartz boats of various sizes that are mounted inside on the chamber door and designed in line with the respective customer requirements.

    Also available on request:

    • An active control device for the process pressure (DSC)
    • A Faraday cage
    • Loading device for different-sized substrates or wafers
    • A ceramic process chamber
    • Special seals for operation with process gas containing fluorine

    P models can be equipped with an automatic loading device that loads the wafers from the cassette independently.

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PVA TePla AG
Im Westpark 10 - 12
D-35435 Wettenberg

Phone: +49 (0) 641/68690-0
Fax: +49 (0) 641/68690-800