Single-Wafer Systems

The plasma systems for single-wafer operation are combined in the GIGAfab product range. These systems are available in various configurations depending on the type of substrate or the customer’s application requirement—from the manually loaded system to the fully automatic version.

Depending on the application, these systems can be equipped with various types of plasma sources: from simple and cost-effective microwave sources and large-scale sources to radical sources with a remote plasma for temperature-sensitive silicon etching processes for thinned wafers. The wafer can be tempered with various concepts here.

In the manually loaded systems, the chamber has a pull-out door, and the wafers lie on the heating or cooling plant mounted on the door. In the automatic systems, the wafers are loaded into the chamber with a robot system by means of on-the-fly alignment.

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Our Single-Wafer Systems

  • Plasma System GIGAfab M

    This plasma system enables entry into applications with higher requirements and special plasma sources. The substrates are loaded into the process chamber by hand, from a single wafer up to 300 mm in size (also thinned with film) through to low quantities of smaller wafers. Planar sources for uniformity of up to 5% are used for paint removal (measured via a 300 mm wafer). Alternatively, in remote operation, a radial source is available for etching of silicon and reduction of stress on thinned wafers or components.

    System advantages & equipment:

    • Fitted with a process chamber with a pull-out table
    • The wafer holder is attached to the inside, which can be heated or cooled depending on the application
    • Alternatively, system with cooling circuit and cooling unit for temperatures from 20 °C to 95 °C (for etching of silicon and removal of SU-8) or an electrically heated system up to 300 °C with optional air cooling for a stable process range between 60 °C and 300 °C

    System control is based on a PC system with a touchscreen so that processes can be run in manual and automatic multi-step operation. The standard system contains a control valve for stable process pressure as well as two gas ducts with automatic flow regulators (MFC); two further gas ducts are optionally available.

  • Plasma System GIGAfab A

    The GIGAfab A is a platform for plasma systems with fully automatic loading by a robot system. Various options allow the respective system to be adapted to the specific requirements of customers. The system is based on a single process chamber, a one-armed robot, a single cassette station for small throughput requirements as well as large-volume systems with multiple process chambers, two-armed robot and multiple cassette stations. On this basis, MPS can equip the plasma system in line with customer requirements. Bridging configurations with an open cassette as well as FOUP or SMIF stations are possible here.

    The design of the process chamber is identical to that of the GIGAfab M systems, except that the loading door is replaced by a lock valve here. Inside the chamber, there is a chuck for holding the wafers, which is equipped a temperature controller depending on the requirement. We use either a system with a cooling circuit and cooling unit for temperatures from 20 °C to 95 °C or an electrically heated system up to 300 °C with optional air cooling for a stable process range between 60 °C and 300 °C here.

    The standard system contains:

    • a control valve for stable process pressure
    • two MFC gas ducts with automatic flow regulators
    • The system is equipped with various microwave sources for paint removal (depending on the customer application & the size of the wafers to be processed)
    • Control is based on a PC system with a touchscreen so that processes can be run in manual and automatic multi-step operation
    • The front tool is set up for a defined size of wafer with an optional SMIF or FOUP station. Alternatively, set-up of a bridging configuration for multiple wafer sizes in the open cassette
  • Plasma System GIGAfab Modular

    The Plasma System GIGAfab Modular is a fully automatic single-wafer system geared towards applications in the LED and MEMS sector. A loading robot with a double arm is used for high throughputs with low operating costs. In addition, this system can be supplemented by up to three process chambers for wafers with a diameter of 100 mm to 200 mm.

    The design of the process chamber has been adapted to the requirements of the smaller wafer size. The chuck concept is implemented either with an electrically heated air-cooling system for a stable process range between 60 °C and 250 °C or with a system with a cooling circuit and cooling unit for temperatures from 20 °C to 95 °C.

    System Advantages:

    • Optimization of the direct microwave source in line with the requirements of single-wafer operation in order to ensure the required uniformity of erosion
    • Control is based on a PC system with a touchscreen so that processes can be run in manual and automatic multi-step operation

    Each process chamber module has its own control unit and contains a regulator for stable process pressure as well as two gas ducts with automatic flow regulators (MFC); two further gas ducts are optionally available.

  • Plasma System GIGAfab Gen2

    The GIGAfab Gen 2 system also uses the technology of the planar microwave source but adapted to the size of the flat screens. The main applications for this system are the cleaning and activation of screense.g. for manufacture by means of the inkjet printing method for organic electronics. This system can be configured for almost every size needed. Loading is carried out with a corresponding external robot system.

    During the process, the substrate lies on a cooling plate with a closed circuit and an external cooling unit. Lift pins enable loading and unloading, with various sensors ensuring the safety of the product and the robot system.

    System advantages & equipment:

    • System control is based on a PC system with a touchscreen. This allows automatic processes with multiple steps as well as manual processing
    • The equipment includes a control valve for the process pressure as well as two gas ducts with flow controllers
    • In addition, there is a configuration in which hydrogen can be used as a process gas

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PVA TePla AG
Im Westpark 10 - 12
D-35435 Wettenberg

Phone: +49 (0) 641/68690-0
Fax: +49 (0) 641/68690-800